Electronic device with dual function outer surface

ABSTRACT

An outer portion of an electronic device has an uneven profile to aid in the dissipation of heat. Raised points in the uneven profile may be manufactured with a non-thermal conductive coating. In one implementation, the outer portion of the device includes a thermally conductive layer having an uneven surface and at least one other surface that is thermally coupled with a heat source. The uneven surface includes high areas that are higher than other areas of the uneven surface. A number of non-thermally conductive second layer areas are located on the high areas of the thermally conductive surface.

BACKGROUND

1. Technical Field of the Invention

Implementations described herein relate generally to electronic devicesand, more particularly, to heat dissipating surfaces of electronicdevices.

2. Description of Related Art

Electronic devices, such as mobile phones, media players, navigationaldevices, laptop computers, and hand held computers are becomingincreasingly useful as technology shrinks the size and increases thecomputational power of such devices. All electronic devices requirepower to operate, some of which is given off as heat.

Heat sinks may be used in electronic devices to help dissipate heat intothe ambient atmosphere. In certain situations, the electronic devices,and in particular, the surface of the heat sink surface, can becomeuncomfortably hot for the user.

SUMMARY

According to one aspect, a device has an outer surface and includes athermally conductive layer and second layer areas. The thermallyconductive layer has an uneven surface and at least one other surfacethat is thermally coupled to a heat source. The uneven surface includesfirst areas that are higher than other areas of the uneven surface andfurther includes the second layer areas located on the first areas ofthe thermally conductive surface.

In another aspect, the second layer areas of the device may benon-thermally conductive areas.

In another aspect, the second layer areas of the device may include aplastic material or an elastomer. The thermally conductive layer mayinclude a metal.

In another aspect, the thermally conductive layer may act as a heat sinkfor the device.

In another aspect, the uneven surface of the thermally conductive layerincludes a wave like contour.

In another aspect, the uneven surface of the thermally conductiveincludes a hill like contour or a box like contour.

In another aspect, the second layer areas are formed of a material thatis relatively easy to grip.

In another aspect, the first areas of the uneven surface are separatedfrom the low areas of the uneven surface by approximately 0.2millimeters to on the order of a few millimeters.

In yet another aspect, an electronic device includes a heat source andan outer surface portion. The outer surface portion includes a thermallyconductive layer having an uneven surface and at least one other surfacethat is thermally coupled to the heat source. The uneven surfaceincludes a plurality of raised areas. Further, the outer surface portionincludes a number of second layer areas located on the raised areas ofthe thermally conductive surface.

In another aspect, the electronic device is a mobile terminal or aportable computer.

In another aspect, the second layer areas of the electronic deviceinclude non-thermally conductive areas.

In another aspect, the plurality of second layer areas of the electronicdevice each include a plastic material or an elastomer.

In another aspect, the thermally conductive layer includes a metal.

In another aspect, the uneven surface includes a wave like contour. Theuneven surface may alternatively include a hill like contour or a boxlike contour.

In another aspect, the plurality of second layer areas may be formed ofa material that is relatively easy to grip.

In yet another aspect, a dual function surface is provided thatcomprises means for dispersing heat, the means for dispersing heathaving a thermally conductive uneven surface. The dual function surfacefurther comprises means for insulating portions of the uneven surfacewith a material that is relatively non-thermally conductive.

In another aspect, the means for insulating portions of the unevensurface has a high coefficient of friction and a pleasant tactile feel.

In another aspect, the uneven surface has a wave contour.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this specification, illustrate an embodiment of the inventionand, together with the description, explain the invention. In thedrawings,

FIG. 1A is a front side view of an exemplary electronic device;

FIG. 1B is a back side view of the exemplary electronic device;

FIG. 2 is a diagram illustrating a cross-section of an exemplaryimplementation of the dual function surface shown in FIG. 1B;

FIG. 3 is a diagram conceptually illustrating the exemplaryimplementation of dual function surface when in use by an operator;

FIG. 4 is a diagram illustrating a cross-section of an alternateexemplary implementation of the dual function surface shown in FIG. 1B;

FIG. 5 is a diagram illustrating a cross-section of another alternateexemplary implementation of the dual function surface shown in FIG. 1B;and

FIG. 6 is a diagram illustrating another exemplary electronic device inwhich the dual function surface is implemented.

DETAILED DESCRIPTION OF EMBODIMENTS

The following detailed description of the invention refers to theaccompanying drawings. The same reference numbers in different drawingsmay identify the same or similar elements. Also, the following detaileddescription does not limit the invention.

As described herein, an outer portion of an electronic device is givenan uneven profile, such as a wavy profile, to aid in the dissipation ofheat. The high points in the uneven profile, such as the peaks of thewavy profile, may be stamped or coated with a non-thermal conductivecoating. The non-thermal conductive coating may be relatively pleasantto user touch. In this manner, the uneven profile portion of theelectronic device functions to both dissipate heat while allowing theuser to comfortably touch or hold the device.

FIGS. 1A and 1B are front side and back side views, respectively, of anexemplary electronic device 100. In this example, electronic device 100is a mobile terminal. More generally, it can be appreciated thatelectronic device 100 can be any type of electronic device.

Device 100 may include housing 110, speaker 120, display 130, controlkeys 140, keypad 150, and microphone 160. Housing 110 may protect thecomponents of device 100 from outside elements. Housing 110 may be madefrom thermoplastics, metals, elastomers (e.g., synthetic rubber and/ornatural rubber), and/or other similar materials. Speaker 120 may provideaudible information to a user of device 100. Display 130 may providevisual information to the user. For example, display 130 may provideinformation regarding incoming or outgoing telephone calls, games,telephone numbers, the current time, e-mail, etc. Control keys 140 maypermit the user to interact with device 100 to cause device 100 toperform one or more operations. Keypad 150 may include a standardtelephone keypad and may include additional keys to enable typinginformation into device 100. Microphone 160 may receive audibleinformation from the user.

At least one portion of housing 110 of device 100 may include an unevensurface portion, referred to as a dual function surface 115 herein. Inthis example, dual function surface 115 is implemented on the back sideof device 100. Dual function surface 115 is designed to dissipate heatwhile having a surface that is pleasant for the user to touch. Dualfunction surface 115 may generally be implemented on any externalsurface of housing 110, and can be particularly useful when implementedon areas of housing 110 from which it is desirable to dissipate heat,such as over a battery charging area or over an area an covers corecircuitry of device 100.

FIG. 2 is a diagram illustrating a cross-section of an exemplaryimplementation of dual function surface 115. In this implementation,dual function surface 115 is shown as having a “wavy” or wave-likeprofile that includes peak portions 216 that are higher than valleyportions 217. The wavy profile may be formed by thermally conductivelayer 210. Layer 210 may be made from, for example, a thermallyconductive metal or other material. Layer 210 may generally operate todissipate heat into the ambient atmosphere through the surface of layer210. In other words, layer 210 may operate as a heat sink in which a topsurface contacts the outside atmosphere and another surface is incontact with, or thermally coupled to, a heat source 250 that is to bedissipated. Heat source 250 may include internal heat producing elementsof device 100, such as electronic circuitry. As conceptually shown viathe dashed arrows in FIG. 2, heat generated by heat source 250 may moveto the cooler outer surface of device 100 via layer 210. The unevenprofile of the top surface of layer 210 provides a relatively largesurface area for dissipating heat. The surface area of the top surfaceof layer 210 may be larger than if layer 210 was constructed as a flatsurface, thus providing additional ventilation surface for heatexchange.

The top surface of layer 210 may be stamped or coated with non-thermalconductive areas 215. As shown, non-thermal conductive areas 215 may belocated at or near the peaks of layer 210 (i.e., near peak portions216). Non-thermal conductive areas 215 may, for example, be implementedas a plastic material (e.g., a thermoplastic) or as an elastomer (e.g.,rubber). In general, the material may be selected as a material that isrelatively non-thermally conductive and has a pleasing tactile feeland/or has a high coefficient of static or dynamic friction (i.e., it's“grippy”). The total area covered by the non-thermal conductive areas215 may be less, and in some implementations, significantly less thanthe total area covered by dual function surface 115. Making layer 210uneven serves to increase the available outer surface, for improvedthermal exchange, and create a relief that allows for non-thermalconductive areas 215 to be simply added.

The amplitude of the waves of layer 210 may vary based on the design ofthe particular device, and may typically vary from the order of a fewtenths of a millimeter to a few millimeters. For example, the amplitude,shown as distance “D” in FIG. 2, may range from approximately 0.2-0.5millimeters to a few millimeters or greater (e.g., 3 millimeters ormore).

FIG. 3 is a diagram conceptually illustrating the exemplaryimplementation of dual function surface 115, as shown in FIG. 2, when inuse by an operator. In this diagram, curve 320 represents an outline ofa human hand touching (e.g., holding) electronic device 100 on dualfunction surface 115. The hand may tend to naturally contact non-thermalconductive areas 215, which may provide a pleasant tactile response/feelwhile providing shielding from the heat of layer 210. In someimplementations, non-thermal conductive area 215 may be designed so thatit is physically very difficult or unlikely for the operator's hand tocontact layer 210. In other applications, it may be acceptable if someportion of the operator's hand comes into contact with layer 210. Inother words, in some applications, non-thermal conductive area 215 mayprovide acceptable results without acting as a complete physicalseparator between the operator's hand and layer 210.

Dual function surface 115, as shown in FIGS. 2 and 3 and as described,includes a thermally conductive layer 210 that includes uneven portionsthat are capped or topped by non-thermal conductive areas 215. The topsprovided by non-thermal conductive areas 215 allow a user to holdelectronic device 100 without actually contacting much or all of theheat dissipating portion of layer 210. Further, waves in dual functionsurface 115 provide for greater ventilation than a flat thermallyconductive surface. Still further, since only the tops of the waves oflayer 210 are covered with non-thermal conductive areas 215, manufactureof dual function surface 115 may be relatively simple and cheap toimplement. For example, non-thermal conductive areas 215 may be stampedor pressed onto layer 210. In this manner, a surface is provided that ispleasant to touch, but yet provides effective heat dissipation. In someimplementations, layer 210 may be a single continuous layer with thepeak portions (i.e., portions 216) being made from a non-thermallyconductive material and the remaining portions being made from athermally conductive material.

It can be appreciated that the “wavy” profile of the top surface oflayer 210 is exemplary. Many other different profiles are possible andmay be used to provide similar functionality. For example, FIG. 4 is across-section diagram illustrating an alternate exemplary implementationof dual function surface 115. In this implementation, dual functionsurface 115 includes a “hilly” profile. The hilly profile is formed by athermally conductive layer 410. Thermally conductive layer 410 may bemade of materials similar to and functions in a manner similar to layer210 (described above).

Layer 410 may be stamped or coated with non-thermal conductive areas415. Non-thermal conductive areas 415 function similarly to non-thermalconductive areas 215 (described above). That is, non-thermal conductiveareas 415 may be located at or near the top of layer 410 and be selectedas a material that is relatively non-thermally conductive and that has apleasing tactile feel and/or is relatively easy to grip.

FIG. 5 is a cross-section diagram illustrating another alternateexemplary implementation of dual function surface 115. In thisimplementation, dual function surface 115 has a “boxy” profile. The boxyprofile is formed by a thermally conductive layer 510. Thermallyconductive layer 510 may be made of materials similar to and functionsin a manner similar to layer 210 (described above).

Layer 510 may be stamped or coated with non-thermal conductive areas515. Non-thermal conductive areas 515 function similarly to non-thermalconductive areas 215 (described above). That is, non-thermal conductiveareas 515 may be located at or near the top of layer 510 and be selectedas a material that is relatively non-thermally conductive and that has apleasing tactile feel and/or is relatively easy to grip/hold.

Although dual function surface 115 is shown in FIG. 1B as beingimplemented in mobile terminal 100, it can be appreciated that dualfunction surface 115 could be implemented with any electronic device.

FIG. 6 is a diagram illustrating another exemplary electronic device inwhich the dual function surface is implemented. As shown, a portablecomputer (i.e., a laptop) 600 may include the dual function surfacedescribed above. Portable computer 600 may include, for example, a touchpad entry portion 601, a keyboard 602, and a display 603. Additionally,portable computer 600 includes a dual function surface 615 (shown as thearea including diagonal lines). Dual function surface 615 may beimplemented as described above, such as the implementations shown inFIGS. 2-5. In this example, dual function surface 615 is located on afront portion of portable computer 600. It can be appreciated that inother implementations, dual function surface 615 may be located in otheror in additional locations on portable computer 600, such as on a backor side surface of portable computer 600.

CONCLUSION

As described above, a dual function surface acts as a heat sink todissipate heat while also including relatively good tactile qualities.

The foregoing description of the embodiments of the invention providesillustration and description, but is not intended to be exhaustive or tolimit the invention to the precise form disclosed. Modifications andvariations are possible in light of the above teachings or may beacquired from practice of the invention.

It should be emphasized that the term “comprises/comprising” when usedin this specification is taken to specify the presence of statedfeatures, integers, steps, or components, but does not preclude thepresence or addition of one or more other features, integers, steps,components, or groups thereof.

No element, act, or instruction used in the description of the presentapplication should be construed as critical or essential to theinvention unless explicitly described as such. Also, as used herein, thearticle “a” is intended to include one or more items. Where only oneitem is intended, the term “one” or similar language is used. Further,the phrase “based on,” as used herein is intended to mean “based, atleast in part, on” unless explicitly stated otherwise.

The scope of the invention is defined by the claims and theirequivalents.

1. A device having an outer surface that comprises: a thermallyconductive layer having an uneven surface and at least one other surfacethat is thermally coupled to a heat source, the uneven surface includinga plurality of first areas that are higher than other areas of theuneven surface; and a plurality of second layer areas located on thefirst areas of the uneven surface.
 2. The device of claim 1, wherein theplurality of second layer areas are non-thermally conductive.
 3. Thedevice of claim 1, wherein the plurality of second layer areas include aplastic material or an elastomer.
 4. The device of claim 3, wherein thethermally conductive layer includes a metal.
 5. The device of claim 1,wherein the thermally conductive layer acts as a heat sink for thedevice.
 6. The device of claim 1, wherein the uneven surface of thethermally conductive layer includes a wave like contour.
 7. The deviceof claim 1, wherein the uneven surface of the thermally conductive layerincludes a hill like or box like contour.
 8. The device of claim 1,wherein the plurality of second layer areas are formed of a materialthat is relatively easy to grip.
 9. The device of claim 1, wherein thefirst areas of the uneven surface are separated from lower areas of theuneven surface by a distance ranging from approximately 0.2 to on theorder of a few millimeters.
 10. An electronic device comprising: a heatsource; and an outer surface portion that includes a thermallyconductive layer having an uneven surface and at least one other surfacethat is thermally coupled to the heat source, the uneven surfaceincluding a plurality of raised areas; and a plurality of second layerareas located on the raised areas of the uneven surface.
 11. Theelectronic device of claim 10, wherein the electronic device is a mobileterminal or a portable computer.
 12. The electronic device of claim 10,wherein the second layer areas include non-thermally conductive areas.13. The electronic device of claim 12, wherein the plurality of secondlayer areas each include a plastic material or an elastomer.
 14. Theelectronic device of claim 13, wherein the thermally conductive layerincludes a metal.
 15. The electronic device of claim 10, wherein theuneven surface includes a wave like contour.
 16. The electronic deviceof claim 10, wherein the uneven surface includes a hill like contour ora box like contour.
 17. The electronic device of claim 10, wherein theplurality of second layer areas are formed of a material is relativelyeasy to grip.
 18. The electronic device of claim 10, wherein the raisedareas of the uneven surface are separated from low areas of the unevensurface by approximately 0.2 millimeters to on the order of a fewmillimeters.
 19. A dual function surface comprising: means fordispersing heat, the means for dispersing heat having a thermallyconductive uneven surface; and means for insulating portions of theuneven surface with a material that is relatively non-thermallyconductive.
 20. The dual function surface of claim 19, wherein thematerial has a high coefficient of friction and a pleasant tactile feel.21. The dual function surface of claim 19, wherein the uneven surfacehas a wave like contour.